2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2024-12-09

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=10774069

issn

979-8-3315-1992-6

eissn

979-8-3315-1991-9