2021 IEEE/ACM International Conference on Technical Debt (TechDebt)

Collection

IEL Online

Publisher

IEEE

Subject

Computing and Processing

Access From

2021-06-25

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=9462944

issn

978-1-6654-1406-7

eissn

978-1-6654-1405-0