2019 IEEE/ACM International Conference on Technical Debt (TechDebt)

Collection

IEL Online

Publisher

IEEE

Subject

Computing and Processing

Access From

2019-08-05

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=8777246

issn

978-1-7281-3372-0

eissn

978-1-7281-3371-3