2018 IEEE/ACM International Conference on Technical Debt (TechDebt)

Collection

IEL Online

Publisher

IEEE

Subject

Computing and Processing

Access From

2018-12-31

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=8592729

issn

978-1-5386-6174-1

eissn

978-1-4503-5713-5