2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2018-12-31

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=8580458

issn

978-1-5386-6760-6

eissn

978-1-5386-6759-0