2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2017-12-25

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=8206642

issn

978-1-5386-1929-2

eissn

978-1-5386-1928-5