2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2015-07-20

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=7153073

issn

978-1-4799-8545-6

eissn

978-1-4799-8625-5