2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2015-03-16

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=7049484

issn

978-2-35500-028-7

eissn

978-2-35500-027-0