2009 International Conference on Electronic Packaging Technology & High Density Packaging

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2009-09-29

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=5234372

issn

978-1-4244-4658-2

eissn

978-1-5090-7084-8