2008 International Conference on Electronic Packaging Technology & High Density Packaging

Collection

IEL Online

Publisher

IEEE

Subject

Engineered Materials, Dielectrics and Plasmas

Access From

2008-08-22

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=4599585

issn

978-1-4244-2739-0

eissn

978-1-5090-8093-9