2008 International Conference on Electronic Materials and Packaging

Collection

IEL Online

Publisher

IEEE

Subject

Engineered Materials, Dielectrics and Plasmas

Access From

2009-02-13

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=4773271

issn

978-1-4244-3620-0

eissn

978-1-5090-8120-2