2008 IEEE 9th VLSI Packaging Workshop of Japan

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2009-01-23

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=4745909

issn

978-1-4244-3498-5

eissn

978-1-4244-3497-8