2007 International Conference on Electronic Materials and Packaging

Collection

IEL Online

Publisher

IEEE

Subject

Engineered Materials, Dielectrics and Plasmas

Access From

2008-05-02

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=4489832

issn

978-1-4244-1909-8

eissn

978-1-5090-8996-3