2006 International Conference on Electronic Materials and Packaging

Collection

IEL Online

Publisher

IEEE

Subject

Engineered Materials, Dielectrics and Plasmas

Access From

2008-01-14

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=4430557

issn

978-1-4244-0833-7

eissn

978-1-5090-9381-6