2012 14th International Conference on Electronic Materials and Packaging (EMAP)

Collection

IEL Online

Publisher

IEEE

Subject

Components, Circuits, Devices and Systems

Access From

2013-04-25

URL

https://ieeexplore.ieee.org/servlet/opac?punumber=6504591

issn

978-1-4673-4945-1

eissn

978-1-4673-4944-4